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The modules package concept has now gained acceptance as it offers compact and easy to handle designs. The semiconductor junctions are electrically isolated from the base allowing common heatsinks and compact designs. The insulating materials used between chip and base is carefully chosen so that the impedance is minimised. The Hirect range extends upto 350 amps and 2200 volts and is available in Diode-Diode, Diode-Thyristor and Thyristor-Thyristor configurations.
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