Backgrinding Tape
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Description
Low adhesion release and uv release. Outstanding characteristics support the backgrind process of wafer manufacturing.
- low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.
- please avoid skin contact, as this could cause rashes.
- please refer to a certified disposal company for safe disposal. (do not incinerate as this may produce toxic gas or odors that can cause nausea if inhaled.
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Backgrinding Tape
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